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Wetting balance (Solderability testing the must system3)

Wetting balance (Solderability testing the must system3)

Place of Origin : China
Brand Name : Ray-Shine
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Wetting balance (Solderability testing the must system3)

Usage:
QUOTING FROM THE IPC/EIA J-STD-003A DOCUMENT:
The solderability determination is made to verify that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered. This is determined by evaluation of the solderability specimen portion of a board or representative coupon which has been processed as part of the panel of boards and subsequently removed for testing per the method selected.
The objective of the solderability test methods described in this standard is to determine the ability of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder and to withstand the rigours of the printed board assembly processes

Technical parameters:


solder temperature

RT-350℃ (32 – 622 °F)

Dipping Speed

0-30mm/S (0 – 1.2 in/s)

Immersion depth

0-30mm (0 – 1.2 in/s)

Dwell time

0-30S

Max Component weight

40g

Force sampling frequency

1,000 Hz

Globule Size

2mm(25mg) 4mm(200mg)

Solder bath diameter

60mm

Solder bath capacity

1kg

Power Supply

240V 50Hz 110V 60Hz

Power Consumption

750W

Net machine weight

56kg

Packed (Shipping ) Size

825mm×334mm×420mm (L×W×H)






Product Tags:

Wetting Balance

      

Solderability tester

      

Solder tester

      
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